Mechanical behavior of solder joints under dynamic four-point impact bending

Tong An, Fei Qin, Jiangang Li. Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectronics Reliability, 51(5):1011-1019, 2011. [doi]

Authors

Tong An

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Fei Qin

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Jiangang Li

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