Through-Silicon-Via assignment for 3D ICs

Jianchang Ao, Sheqin Dong, Song Chen, Satoshi Goto. Through-Silicon-Via assignment for 3D ICs. In 2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011. pages 353-356, IEEE, 2011. [doi]

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