Unstructured Direct Ink Write 3D Printing of Functional Structures with Ambient Temperature Curing Dual-Network Thermoset Ink

Connor D. Armstrong, Liang Yue, Frédéric Demoly, Kun Zhou, H. Jerry Qi. Unstructured Direct Ink Write 3D Printing of Functional Structures with Ambient Temperature Curing Dual-Network Thermoset Ink. Adv. Intell. Syst., 5(1), January 2023. [doi]

@article{ArmstrongYDZQ23,
  title = {Unstructured Direct Ink Write 3D Printing of Functional Structures with Ambient Temperature Curing Dual-Network Thermoset Ink},
  author = {Connor D. Armstrong and Liang Yue and Frédéric Demoly and Kun Zhou and H. Jerry Qi},
  year = {2023},
  month = {January},
  doi = {10.1002/aisy.202200226},
  url = {https://doi.org/10.1002/aisy.202200226},
  researchr = {https://researchr.org/publication/ArmstrongYDZQ23},
  cites = {0},
  citedby = {0},
  journal = {Adv. Intell. Syst.},
  volume = {5},
  number = {1},
}