3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters - researchr publication authors

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Erfan Azarkhish, Igor Loi, Luca Benini. 3D logarithmic interconnect: Stacking multiple L1 memory dies over multi-core clusters. In 2013 Seventh IEEE/ACM International Symposium on Networks-on-Chip (NoCS), Tempe, AZ, USA, April 21-24, 2013. pages 1-2, IEEE, 2013. [doi]

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Luca Benini

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