Clara Berenguer, Adriano Borges, Sávio Freire, Nicolli Rios, Rodrigo O. Spínola. Investigando a Relação entre a Prevenção da Dívida Técnica e as Atividades de Desenvolvimento de Software: Um Survey com Profissionais. In Yolande E. Chan, Maric Boudreau, Benoit Aubert, Guy Paré, Wynne Chin, editors, 27th Americas Conference on Information Systems, AMCIS 2021, Virtual Conference, August 9-13, 2021. Association for Information Systems, 2021. [doi]
@inproceedings{BerenguerBFRS21,
title = {Investigando a Relação entre a Prevenção da Dívida Técnica e as Atividades de Desenvolvimento de Software: Um Survey com Profissionais},
author = {Clara Berenguer and Adriano Borges and Sávio Freire and Nicolli Rios and Rodrigo O. Spínola},
year = {2021},
url = {https://aisel.aisnet.org/amcis2021/lacais/lacais/4},
researchr = {https://researchr.org/publication/BerenguerBFRS21},
cites = {0},
citedby = {0},
booktitle = {27th Americas Conference on Information Systems, AMCIS 2021, Virtual Conference, August 9-13, 2021},
editor = {Yolande E. Chan and Maric Boudreau and Benoit Aubert and Guy Paré and Wynne Chin},
publisher = {Association for Information Systems},
}