Prospects of 3D inductors on through silicon vias processes for 3D ICs

Yiorgos I. Bontzios, Michael G. Dimopoulos, Alkis A. Hatzopoulos. Prospects of 3D inductors on through silicon vias processes for 3D ICs. In IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, China, October 3-5, 2011. pages 90-93, IEEE, 2011. [doi]

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