High-Throughput and Low-Power Integrated Direct/Inverse HEVC Quantization Hardware Design

Luciano A. Braatz, Bruno Zatt, Daniel Palomino, Luciano Volcan Agostini, Marcelo Schiavon Porto. High-Throughput and Low-Power Integrated Direct/Inverse HEVC Quantization Hardware Design. In IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy. pages 1-5, IEEE, 2018. [doi]

@inproceedings{BraatzZPAP18,
  title = {High-Throughput and Low-Power Integrated Direct/Inverse HEVC Quantization Hardware Design},
  author = {Luciano A. Braatz and Bruno Zatt and Daniel Palomino and Luciano Volcan Agostini and Marcelo Schiavon Porto},
  year = {2018},
  doi = {10.1109/ISCAS.2018.8351183},
  url = {https://doi.org/10.1109/ISCAS.2018.8351183},
  researchr = {https://researchr.org/publication/BraatzZPAP18},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy},
  publisher = {IEEE},
  isbn = {978-1-5386-4881-0},
}