Christoph H. van der Broeck, Marcus Conrad, Rik W. De Doncker. A thermal modeling methodology for power semiconductor modules. Microelectronics Reliability, 55(9-10):1938-1944, 2015. [doi]
@article{BroeckCD15,
title = {A thermal modeling methodology for power semiconductor modules},
author = {Christoph H. van der Broeck and Marcus Conrad and Rik W. De Doncker},
year = {2015},
doi = {10.1016/j.microrel.2015.06.102},
url = {http://dx.doi.org/10.1016/j.microrel.2015.06.102},
researchr = {https://researchr.org/publication/BroeckCD15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {9-10},
pages = {1938-1944},
}