William E. Burdick Jr., Wolfgang Daum. High-Yield Multichip Modules Based on Minimal IC Pretest. In Proceedings IEEE International Test Conference 1994, TEST: The Next 25 Years, Washington, DC, USA, October 2-6, 1994. pages 30-40, IEEE Computer Society, 1994.
@inproceedings{BurdickD94,
title = {High-Yield Multichip Modules Based on Minimal IC Pretest},
author = {William E. Burdick Jr. and Wolfgang Daum},
year = {1994},
tags = {rule-based, e-science},
researchr = {https://researchr.org/publication/BurdickD94},
cites = {0},
citedby = {0},
pages = {30-40},
booktitle = {Proceedings IEEE International Test Conference 1994, TEST: The Next 25 Years, Washington, DC, USA, October 2-6, 1994},
publisher = {IEEE Computer Society},
isbn = {0-7803-2103-0},
}