A physics-based electromigration reliability model for interconnects lifetime prediction

Linlin Cai, Wangyong Chen, JinFeng Kang, Gang Du, Xiaoyan Liu, Xing Zhang. A physics-based electromigration reliability model for interconnects lifetime prediction. Science in China Series F: Information Sciences, 64(11), 2021. [doi]

@article{CaiCKDLZ21,
  title = {A physics-based electromigration reliability model for interconnects lifetime prediction},
  author = {Linlin Cai and Wangyong Chen and JinFeng Kang and Gang Du and Xiaoyan Liu and Xing Zhang},
  year = {2021},
  doi = {10.1007/s11432-020-3140-4},
  url = {https://doi.org/10.1007/s11432-020-3140-4},
  researchr = {https://researchr.org/publication/CaiCKDLZ21},
  cites = {0},
  citedby = {0},
  journal = {Science in China Series F: Information Sciences},
  volume = {64},
  number = {11},
}