Rong Cao, Guandong Liu, Jie Li, Weihao Wang, Chuanzhi Wang, Lingling Liu, Yuanxing Duan. Research on the Cooling System for the System-on-Wafer Packaging. In 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023. pages 33-36, IEEE, 2023. [doi]
@inproceedings{CaoLLWWLD23,
title = {Research on the Cooling System for the System-on-Wafer Packaging},
author = {Rong Cao and Guandong Liu and Jie Li and Weihao Wang and Chuanzhi Wang and Lingling Liu and Yuanxing Duan},
year = {2023},
doi = {10.1109/NEMS57332.2023.10190863},
url = {https://doi.org/10.1109/NEMS57332.2023.10190863},
researchr = {https://researchr.org/publication/CaoLLWWLD23},
cites = {0},
citedby = {0},
pages = {33-36},
booktitle = {18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Jeju Island, Korea, Republic of, May 14-17, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3348-0},
}