Simulation of failure time distributions of metal lines under electromigration

M. R. Carriero, S. Di Pascoli, Giuseppe Iannaccone. Simulation of failure time distributions of metal lines under electromigration. Microelectronics Reliability, 42(9-11):1469-1472, 2002. [doi]

@article{CarrieroPI02,
  title = {Simulation of failure time distributions of metal lines under electromigration},
  author = {M. R. Carriero and S. Di Pascoli and Giuseppe Iannaccone},
  year = {2002},
  doi = {10.1016/S0026-2714(02)00172-5},
  url = {http://dx.doi.org/10.1016/S0026-2714(02)00172-5},
  researchr = {https://researchr.org/publication/CarrieroPI02},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {42},
  number = {9-11},
  pages = {1469-1472},
}