Toward quantifying the IC design value of interconnect technology improvements - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Tuck Boon Chan, Andrew B. Kahng, Jiajia Li. Toward quantifying the IC design value of interconnect technology improvements. In ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2013, Austin, TX, USA, June 2, 2013. pages 1-6, IEEE, 2013. [doi]

This author has not been identified. Look up 'Tuck Boon Chan' in GoogleThis author has not been identified. Look up 'Andrew B. Kahng' in GoogleThis author has not been identified. Look up 'Jiajia Li' in Google

runs on WebDSL