Methodology for electromigration signoff in the presence of adaptive voltage scaling

Wei-Ting Jonas Chan, Andrew B. Kahng, Siddhartha Nath. Methodology for electromigration signoff in the presence of adaptive voltage scaling. In ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2014, San Francisco, CA, USA, June 1, 2014. pages 1-7, IEEE, 2014. [doi]

@inproceedings{ChanKN14a,
  title = {Methodology for electromigration signoff in the presence of adaptive voltage scaling},
  author = {Wei-Ting Jonas Chan and Andrew B. Kahng and Siddhartha Nath},
  year = {2014},
  doi = {10.1145/2633948.2633954},
  url = {http://dx.doi.org/10.1145/2633948.2633954},
  researchr = {https://researchr.org/publication/ChanKN14a},
  cites = {0},
  citedby = {0},
  pages = {1-7},
  booktitle = {ACM/IEEE International Workshop on System Level Interconnect Prediction, SLIP 2014, San Francisco, CA, USA, June 1, 2014},
  publisher = {IEEE},
}