Y. C. Chan, P. L. Tu, K. C. Hung. Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectronics Reliability, 41(11):1867-1875, 2001. [doi]
@article{ChanTH01,
title = {Study of the self-alignment of no-flow underfill for micro-BGA assembly},
author = {Y. C. Chan and P. L. Tu and K. C. Hung},
year = {2001},
doi = {10.1016/S0026-2714(01)00041-5},
url = {http://dx.doi.org/10.1016/S0026-2714(01)00041-5},
tags = {data-flow, C++},
researchr = {https://researchr.org/publication/ChanTH01},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {41},
number = {11},
pages = {1867-1875},
}