Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder. Role of Through Silicon Via in 3D Integration: Impact on Delay and Power. Journal of Circuits, Systems, and Computers, 30(3), 2021. [doi]
@article{ChandrakarGM21,
title = {Role of Through Silicon Via in 3D Integration: Impact on Delay and Power},
author = {Shivangi Chandrakar and Deepika Gupta and Manoj Kumar Majumder},
year = {2021},
doi = {10.1142/S0218126621500511},
url = {https://doi.org/10.1142/S0218126621500511},
researchr = {https://researchr.org/publication/ChandrakarGM21},
cites = {0},
citedby = {0},
journal = {Journal of Circuits, Systems, and Computers},
volume = {30},
number = {3},
}