Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM) - researchr publication authors

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Meng-Fan Chang, Pi-Feng Chiu, Wei-Cheng Wu, Ching-Hao Chuang, Shyh-Shyuan Sheu. Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM). In 2011 IEEE 9th International Conference on ASIC, ASICON 2011, Xiamen, China, October 25-28, 2011. pages 299-302, IEEE, 2011. [doi]

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