Y.-W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang. Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. Microelectronics Reliability, 53(1):41-46, 2013. [doi]
@article{ChangPYCCZJH13,
title = {Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps},
author = {Y.-W. Chang and H. Y. Peng and R. W. Yang and Chih Chen and T. C. Chang and Chau-Jie Zhan and Jin-Ye Juang and Annie T. Huang},
year = {2013},
doi = {10.1016/j.microrel.2012.08.021},
url = {http://dx.doi.org/10.1016/j.microrel.2012.08.021},
researchr = {https://researchr.org/publication/ChangPYCCZJH13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {1},
pages = {41-46},
}