Using expert technology to select unstable slicing machine to control wafer slicing quality via fuzzy AHP

Che-Wei Chang, Cheng-Ru Wu, Huang-Chu Chen. Using expert technology to select unstable slicing machine to control wafer slicing quality via fuzzy AHP. Expert Syst. Appl., 34(3):2210-2220, 2008. [doi]

@article{ChangWC08:3,
  title = {Using expert technology to select unstable slicing machine to control wafer slicing quality via fuzzy AHP},
  author = {Che-Wei Chang and Cheng-Ru Wu and Huang-Chu Chen},
  year = {2008},
  doi = {10.1016/j.eswa.2007.02.042},
  url = {http://dx.doi.org/10.1016/j.eswa.2007.02.042},
  tags = {slicing},
  researchr = {https://researchr.org/publication/ChangWC08%3A3},
  cites = {0},
  citedby = {0},
  journal = {Expert Syst. Appl.},
  volume = {34},
  number = {3},
  pages = {2210-2220},
}