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Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys

S. Chavali, Y. Singh, G. Subbarayan, A. Bansal, M. Ahmad. Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. Microelectronics Reliability, 53(6):892-898, 2013. [doi]

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S. Chavali

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Y. Singh

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G. Subbarayan

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A. Bansal

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M. Ahmad

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