Kuo-Ming Chen, Kuo-Ning Chiang. Impact of probing procedure on flip chip reliability. Microelectronics Reliability, 43(1):123-130, 2003. [doi]
@article{ChenC03,
title = {Impact of probing procedure on flip chip reliability},
author = {Kuo-Ming Chen and Kuo-Ning Chiang},
year = {2003},
doi = {10.1016/S0026-2714(02)00267-6},
url = {http://dx.doi.org/10.1016/S0026-2714(02)00267-6},
tags = {reliability},
researchr = {https://researchr.org/publication/ChenC03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {1},
pages = {123-130},
}