An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications - researchr publication authors

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Cai Chen, Yu Chen, Yuxiong Li, Zhizhao Huang, Teng Liu, Yong Kang. An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications. IEEE Transactions on Industrial Electronics, 64(11):8980-8991, 2017. [doi]

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