26.6 A 2.667Gb/s DDR3 memory interface with asymmetric ODT on wirebond package and single-side-mounted PCB - researchr publication authors

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Shang-Ping Chen, Chih-Chien Hung, Qui-Ting Chen, Sheng-Ming Chang, Ming-Shi Liou, Bo-Wei Hsieh, Hsiang-I. Huang, Brian Liu, Yan-Bin Luo. 26.6 A 2.667Gb/s DDR3 memory interface with asymmetric ODT on wirebond package and single-side-mounted PCB. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 448-449, IEEE, 2014. [doi]

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