Kun-Chih Chen, Huai-Ting Li, An-Yeu Andy Wu. LMS-based adaptive temperature prediction scheme for proactive thermal-aware three-dimensional Network-on-Chip systems. In Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2014, Hsinchu, Taiwan, April 28-30, 2014. pages 1-4, IEEE, 2014. [doi]
@inproceedings{ChenLW14-8,
title = {LMS-based adaptive temperature prediction scheme for proactive thermal-aware three-dimensional Network-on-Chip systems},
author = {Kun-Chih Chen and Huai-Ting Li and An-Yeu Andy Wu},
year = {2014},
doi = {10.1109/VLSI-DAT.2014.6834910},
url = {http://dx.doi.org/10.1109/VLSI-DAT.2014.6834910},
researchr = {https://researchr.org/publication/ChenLW14-8},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2014, Hsinchu, Taiwan, April 28-30, 2014},
publisher = {IEEE},
}