Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin-Ta Chen, Po-Kuan Shen, Teng-Zhang Zhu, Chia-Chi Chang, Shu-Shuan Lin, Mao-Yuan Zeng, Chien-Yu Chiu, Hsu-Liang Hsiao, Hsiao-Chin Lan, Yun-Chih Lee, Yo-Shen Lin, Mount-Learn Wu. Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. In Optical Fiber Communications Conference and Exhibition, OFC 2014, San Francisco, CA, USA, March 9-13, 2014. pages 1-3, IEEE, 2014. [doi]

@inproceedings{ChenSZCLZCHLLLW14,
  title = {Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate},
  author = {Chin-Ta Chen and Po-Kuan Shen and Teng-Zhang Zhu and Chia-Chi Chang and Shu-Shuan Lin and Mao-Yuan Zeng and Chien-Yu Chiu and Hsu-Liang Hsiao and Hsiao-Chin Lan and Yun-Chih Lee and Yo-Shen Lin and Mount-Learn Wu},
  year = {2014},
  doi = {10.1109/OFC.2014.6886567},
  url = {https://doi.org/10.1109/OFC.2014.6886567},
  researchr = {https://researchr.org/publication/ChenSZCLZCHLLLW14},
  cites = {0},
  citedby = {0},
  pages = {1-3},
  booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2014, San Francisco, CA, USA, March 9-13, 2014},
  publisher = {IEEE},
}