Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed. Investigation on copper diffusion depth in copper wire bonding. Microelectronics Reliability, 51(1):166-170, 2011. [doi]
@article{ChenZLM11,
title = {Investigation on copper diffusion depth in copper wire bonding},
author = {Catherine H. Chen and Shawn X. Zhang and S. W. Ricky Lee and Lebbai Mohamed},
year = {2011},
doi = {10.1016/j.microrel.2010.09.030},
url = {http://dx.doi.org/10.1016/j.microrel.2010.09.030},
researchr = {https://researchr.org/publication/ChenZLM11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {1},
pages = {166-170},
}