Tz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta. Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. Microelectronics Reliability, 50(12):2037-2050, 2010. [doi]
No references recorded for this publication.
No citations of this publication recorded.