A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor

Eun-Ho Choi, Seong-Mun Kim, Kyoungmin Park, Sanghyun Heo, Hyunggun Ma, Gyeongho Namgoong, Haksun Kim, Franklin Bien. A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor. IEEE Trans. on Circuits and Systems, 67-II(7):1224-1228, 2020. [doi]

@article{ChoiKPHMNKB20,
  title = {A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor},
  author = {Eun-Ho Choi and Seong-Mun Kim and Kyoungmin Park and Sanghyun Heo and Hyunggun Ma and Gyeongho Namgoong and Haksun Kim and Franklin Bien},
  year = {2020},
  doi = {10.1109/TCSII.2019.2937541},
  url = {https://doi.org/10.1109/TCSII.2019.2937541},
  researchr = {https://researchr.org/publication/ChoiKPHMNKB20},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on Circuits and Systems},
  volume = {67-II},
  number = {7},
  pages = {1224-1228},
}