3-D thermal simulation with dynamic power profiles

Eunjoo Choi, Youngsoo Shin. 3-D thermal simulation with dynamic power profiles. In International Symposium on Circuits and Systems (ISCAS 2008), 18-21 May 2008, Sheraton Seattle Hotel, Seattle, Washington, USA. pages 2765-2768, IEEE, 2008. [doi]

@inproceedings{ChoiS08,
  title = {3-D thermal simulation with dynamic power profiles},
  author = {Eunjoo Choi and Youngsoo Shin},
  year = {2008},
  doi = {10.1109/ISCAS.2008.4542030},
  url = {http://dx.doi.org/10.1109/ISCAS.2008.4542030},
  researchr = {https://researchr.org/publication/ChoiS08},
  cites = {0},
  citedby = {0},
  pages = {2765-2768},
  booktitle = {International Symposium on Circuits and Systems (ISCAS 2008), 18-21 May 2008, Sheraton Seattle Hotel, Seattle, Washington, USA},
  publisher = {IEEE},
}