The third revolution in semiconductor packaging and system integration

Carlo Cognetti. The third revolution in semiconductor packaging and system integration. In 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008, St. Julien's, Malta, August 31 2008-September 3, 2008. pages 9-10, IEEE, 2008. [doi]

@inproceedings{Cognetti08,
  title = {The third revolution in semiconductor packaging and system integration},
  author = {Carlo Cognetti},
  year = {2008},
  doi = {10.1109/ICECS.2008.4675124},
  url = {http://dx.doi.org/10.1109/ICECS.2008.4675124},
  researchr = {https://researchr.org/publication/Cognetti08},
  cites = {0},
  citedby = {0},
  pages = {9-10},
  booktitle = {15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008, St. Julien's, Malta, August 31 2008-September 3, 2008},
  publisher = {IEEE},
  isbn = {978-1-4244-2181-7},
}