Compact and Broadband Asymmetric Curved Directional Couplers Using the Silicon-On-Insulator (SOI) Platform

Lemi Bedjisa Dano, San-Liang Lee, Wen-Hsien Fang. Compact and Broadband Asymmetric Curved Directional Couplers Using the Silicon-On-Insulator (SOI) Platform. In 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC), Fukuoka, Japan, July 7-11, 2019. pages 1-3, IEEE, 2019. [doi]

@inproceedings{DanoLF19,
  title = {Compact and Broadband Asymmetric Curved Directional Couplers Using the Silicon-On-Insulator (SOI) Platform},
  author = {Lemi Bedjisa Dano and San-Liang Lee and Wen-Hsien Fang},
  year = {2019},
  doi = {10.23919/PS.2019.8818157},
  url = {https://doi.org/10.23919/PS.2019.8818157},
  researchr = {https://researchr.org/publication/DanoLF19},
  cites = {0},
  citedby = {0},
  pages = {1-3},
  booktitle = {2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC), Fukuoka, Japan, July 7-11, 2019},
  publisher = {IEEE},
  isbn = {978-4-88552-321-2},
}