Ertugrul Demircan. Effects of Interconnect Process Variations on Signal Integrity. In 2006 IEEE International SOC Conference, Austin, Texas, USA, September 24-27, 2006. pages 281-284, IEEE, 2006. [doi]
@inproceedings{Demircan06,
title = {Effects of Interconnect Process Variations on Signal Integrity},
author = {Ertugrul Demircan},
year = {2006},
doi = {10.1109/SOCC.2006.283898},
url = {http://dx.doi.org/10.1109/SOCC.2006.283898},
researchr = {https://researchr.org/publication/Demircan06},
cites = {0},
citedby = {0},
pages = {281-284},
booktitle = {2006 IEEE International SOC Conference, Austin, Texas, USA, September 24-27, 2006},
publisher = {IEEE},
isbn = {0-7803-9781-9},
}