Erping Deng, Zhibin Zhao, Qingming Xin, Jingwei Zhang, Yongzhang Huang. Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs. Microelectronics Reliability, 78:25-37, 2017. [doi]
@article{DengZXZH17,
title = {Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs},
author = {Erping Deng and Zhibin Zhao and Qingming Xin and Jingwei Zhang and Yongzhang Huang},
year = {2017},
doi = {10.1016/j.microrel.2017.07.095},
url = {https://doi.org/10.1016/j.microrel.2017.07.095},
researchr = {https://researchr.org/publication/DengZXZH17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {78},
pages = {25-37},
}