High-throughput TSV testing and characterization for 3D integration using thermal mapping - researchr publication authors

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Kapil Dev, Gary Woods, Sherief Reda. High-throughput TSV testing and characterization for 3D integration using thermal mapping. In The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013. pages 73, ACM, 2013. [doi]

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