Peter Dietrich. Trends in automotive power semiconductor packaging. Microelectronics Reliability, 53(9-11):1681-1686, 2013. [doi]
@article{Dietrich13-0,
title = {Trends in automotive power semiconductor packaging},
author = {Peter Dietrich},
year = {2013},
doi = {10.1016/j.microrel.2013.07.088},
url = {http://dx.doi.org/10.1016/j.microrel.2013.07.088},
researchr = {https://researchr.org/publication/Dietrich13-0},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {9-11},
pages = {1681-1686},
}