Peter Dietrich. Joining and package technology for 175 °C Tj increasing reliability in automotive applications. Microelectronics Reliability, 54(9-10):1901-1905, 2014. [doi]
@article{Dietrich14-1,
title = {Joining and package technology for 175 °C Tj increasing reliability in automotive applications},
author = {Peter Dietrich},
year = {2014},
doi = {10.1016/j.microrel.2014.08.007},
url = {http://dx.doi.org/10.1016/j.microrel.2014.08.007},
researchr = {https://researchr.org/publication/Dietrich14-1},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1901-1905},
}