Multi-Core Fiber Socket-Assisted Packaging for 84-Channel Ultra-Dense Silicon Photonics IO - researchr publication authors

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Gligor Djogo, Stephen Ho, Moez Haque, Erden Ertorer, Jianzhao Li, Jun Liu, Xiaolu Song, Jing Suo, Peter R. Herman. Multi-Core Fiber Socket-Assisted Packaging for 84-Channel Ultra-Dense Silicon Photonics IO. In Optical Fiber Communications Conference and Exhibition, OFC 2019, San Diego, CA, USA, March 3-7, 2019. pages 1-3, IEEE, 2019. [doi]

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