Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights - researchr publication authors

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Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung. Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights. In Hamid R. Arabnia, editor, Proceedings of the 2007 International Conference on Image Processing, Computer Vision, & Pattern Recognition, IPCV 2007, June 25-28, 2007, Las Vegas Nevada, USA. pages 157-163, CSREA Press, 2007.

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