Reliability of aluminum-bearing ohmic contacts to SiC under high current density

Brian P. Downey, Suzanne E. Mohney, Trevor E. Clark, Joseph R. Flemish. Reliability of aluminum-bearing ohmic contacts to SiC under high current density. Microelectronics Reliability, 50(12):1967-1972, 2010. [doi]

@article{DowneyMCF10-0,
  title = {Reliability of aluminum-bearing ohmic contacts to SiC under high current density},
  author = {Brian P. Downey and Suzanne E. Mohney and Trevor E. Clark and Joseph R. Flemish},
  year = {2010},
  doi = {10.1016/j.microrel.2010.07.007},
  url = {https://doi.org/10.1016/j.microrel.2010.07.007},
  researchr = {https://researchr.org/publication/DowneyMCF10-0},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {50},
  number = {12},
  pages = {1967-1972},
}