W. D. van Driel, D. G. Yang, G. Q. Zhang. On chip-package stress interaction. Microelectronics Reliability, 48(8-9):1268-1272, 2008. [doi]
@article{DrielYZ08,
title = {On chip-package stress interaction},
author = {W. D. van Driel and D. G. Yang and G. Q. Zhang},
year = {2008},
doi = {10.1016/j.microrel.2008.06.039},
url = {http://dx.doi.org/10.1016/j.microrel.2008.06.039},
researchr = {https://researchr.org/publication/DrielYZ08},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {8-9},
pages = {1268-1272},
}