Yankang Du, Shuming Chen. A Novel Layout-Based Single Event Transient Injection Approach to Evaluate the Soft Error Rate of Large Combinational Circuits in Complimentary Metal-Oxide-Semiconductor Bulk Technology. IEEE Transactions on Reliability, 65(1):248-255, 2016. [doi]
@article{DuC16,
title = {A Novel Layout-Based Single Event Transient Injection Approach to Evaluate the Soft Error Rate of Large Combinational Circuits in Complimentary Metal-Oxide-Semiconductor Bulk Technology},
author = {Yankang Du and Shuming Chen},
year = {2016},
doi = {10.1109/TR.2015.2427372},
url = {http://dx.doi.org/10.1109/TR.2015.2427372},
researchr = {https://researchr.org/publication/DuC16},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Reliability},
volume = {65},
number = {1},
pages = {248-255},
}