Work-in-Process: Smart Migration for Reliability Enhancement of 3D TLC NAND Flash Storage Systems

Yazhi Du, Jihua Gu, Zhongzhe Xiao, Min Huang 0002. Work-in-Process: Smart Migration for Reliability Enhancement of 3D TLC NAND Flash Storage Systems. In Tulika Mitra, Andreas Gerstlauer, editors, International Conference on Compilers, Architecture, and Synthesis for Embedded Systems, CASES 2020, Singapore, September 20-25, 2020. pages 4-5, IEEE, 2020. [doi]

@inproceedings{DuGX020,
  title = {Work-in-Process: Smart Migration for Reliability Enhancement of 3D TLC NAND Flash Storage Systems},
  author = {Yazhi Du and Jihua Gu and Zhongzhe Xiao and Min Huang 0002},
  year = {2020},
  doi = {10.1109/CASES51649.2020.9243811},
  url = {https://doi.org/10.1109/CASES51649.2020.9243811},
  researchr = {https://researchr.org/publication/DuGX020},
  cites = {0},
  citedby = {0},
  pages = {4-5},
  booktitle = {International Conference on Compilers, Architecture, and Synthesis for Embedded Systems, CASES 2020, Singapore, September 20-25, 2020},
  editor = {Tulika Mitra and Andreas Gerstlauer},
  publisher = {IEEE},
  isbn = {978-1-7281-9192-8},
}