Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden. 6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 120-121, IEEE, 2014. [doi]
@inproceedings{ErdmannLLKMCBKL14,
title = {6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters},
author = {Christophe Erdmann and Donnacha Lowney and Adrian Lynam and Aidan Keady and John McGrath and Edward Cullen and Daire Breathnach and Denis Keane and Patrick Lynch and Marites De La Torre and Ronnie De La Torre and Peng Lim and Anthony Collins and Brendan Farley and Liam Madden},
year = {2014},
doi = {10.1109/ISSCC.2014.6757364},
url = {https://doi.org/10.1109/ISSCC.2014.6757364},
researchr = {https://researchr.org/publication/ErdmannLLKMCBKL14},
cites = {0},
citedby = {0},
pages = {120-121},
booktitle = {2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014},
publisher = {IEEE},
isbn = {978-1-4799-0918-6},
}