Steven B. Estrella, Thomas P. Dorch, Trevor M. Cooper, Aaron Maharry, Takako Hirokawa, Daniel S. Renner, Clint L. Schow. Novel Link Architecture Minimizing Thermal Energy Dissipation for Cryogenic Optical Interconnects. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]
@inproceedings{EstrellaDCMHRS21,
title = {Novel Link Architecture Minimizing Thermal Energy Dissipation for Cryogenic Optical Interconnects},
author = {Steven B. Estrella and Thomas P. Dorch and Trevor M. Cooper and Aaron Maharry and Takako Hirokawa and Daniel S. Renner and Clint L. Schow},
year = {2021},
url = {https://ieeexplore.ieee.org/document/9489903},
researchr = {https://researchr.org/publication/EstrellaDCMHRS21},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021},
publisher = {IEEE},
isbn = {978-1-943580-86-6},
}