Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

A. S. Fleischer, U. Troppenz, M. Hamacher, W. John. Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. Microelectronics Reliability, 46(2-4):421-431, 2006. [doi]

Authors

A. S. Fleischer

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U. Troppenz

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M. Hamacher

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W. John

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