Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications - researchr publication authors

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Paul D. Franzon, John Wilson, Ming Li. Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]

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