Wenwen Fu, Jinli Yan, Wei Quan 0004, ZhiGang Sun. Fenglin-I: an open-source TSN chip for scenario-driven customization. In SIGCOMM '20: ACM SIGCOMM 2020 Conference, Virtual Event, August 10-14, 2020, Poster and Demo Sessions. pages 60-61, ACM, 2020. [doi]
@inproceedings{FuY0S20, title = {Fenglin-I: an open-source TSN chip for scenario-driven customization}, author = {Wenwen Fu and Jinli Yan and Wei Quan 0004 and ZhiGang Sun}, year = {2020}, doi = {10.1145/3405837.3411392}, url = {https://doi.org/10.1145/3405837.3411392}, researchr = {https://researchr.org/publication/FuY0S20}, cites = {0}, citedby = {0}, pages = {60-61}, booktitle = {SIGCOMM '20: ACM SIGCOMM 2020 Conference, Virtual Event, August 10-14, 2020, Poster and Demo Sessions}, publisher = {ACM}, isbn = {978-1-4503-8048-5}, }