The following publications are possibly variants of this publication:
- A boundary-type meshless solver for transient heat conduction analysis of slender functionally graded materials with exponential variationsZhuo-Jia Fu, Qiang Xi, Wen Chen 0003, Alexander H. D. Cheng. cma, 76(4):760-773, 2018. [doi]
- MLS-based numerical manifold method for steady-state three-dimensional heat conduction problems of functionally graded materialsLimei Zhang, Hong Zheng, Feng Liu. cma, 144:124-140, August 2023. [doi]
- Three-dimensional transient heat conduction analysis by boundary knot methodZhuo-Jia Fu, Jin-Hong Shi, Wen Chen, Li-wen Yang. mcs, 165:306-317, 2019. [doi]