Temporary bonding strength control for self-assembly-based 3D integration - researchr publication authors

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Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. Temporary bonding strength control for self-assembly-based 3D integration. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

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