Modeling and Analysis of Magnetic Adhesion Module for Wall-Climbing Robot

Xiaoshan Gao, Liang Yan 0001, Gang Wang 0025, I-Ming Chen. Modeling and Analysis of Magnetic Adhesion Module for Wall-Climbing Robot. IEEE T. Instrumentation and Measurement, 72:1-9, 2023. [doi]

@article{GaoYWC23,
  title = {Modeling and Analysis of Magnetic Adhesion Module for Wall-Climbing Robot},
  author = {Xiaoshan Gao and Liang Yan 0001 and Gang Wang 0025 and I-Ming Chen},
  year = {2023},
  doi = {10.1109/TIM.2022.3224522},
  url = {https://doi.org/10.1109/TIM.2022.3224522},
  researchr = {https://researchr.org/publication/GaoYWC23},
  cites = {0},
  citedby = {0},
  journal = {IEEE T. Instrumentation and Measurement},
  volume = {72},
  pages = {1-9},
}